(module MMA8452QR1 (layer F.Cu) (tedit 5A7401D7)
  (descr "16-Lead Plastic Quad Flat, No Lead Package (NG) - 3x3x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf)")
  (tags "QFN 0.5")
  (attr smd)
  (fp_text reference U2 (at -1.639 -2.687 90) (layer F.SilkS))
  (fp_text value MMA8452QR1 (at 0 2.85) (layer F.Fab) hide)
  (pad 1 smd rect (at -1.275 -1) (size 0.813 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -1.275 -0.5) (size 0.813 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -1.275 0) (size 0.813 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at -1.275 0.5) (size 0.813 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at -1.275 1) (size 0.813 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at -0.5 1.275 90) (size 0.813 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at 0 1.275 90) (size 0.813 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd rect (at 0.5 1.275 90) (size 0.813 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd rect (at 1.275 1) (size 0.813 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 10 smd rect (at 1.275 0.5) (size 0.813 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 11 smd rect (at 1.275 0) (size 0.813 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 12 smd rect (at 1.275 -0.5) (size 0.813 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 13 smd rect (at 1.275 -1) (size 0.813 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 14 smd rect (at 0.5 -1.275 90) (size 0.813 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 15 smd rect (at 0 -1.275 90) (size 0.813 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 16 smd rect (at -0.5 -1.275 90) (size 0.813 0.305) (layers F.Cu F.Paste F.Mask))
  (model Housings_DFN_QFN.3dshapes/QFN-16-1EP_3x3mm_Pitch0.5mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
